Apple Introduces the M2 Ultra Chip
At WWDC 2023, Apple announced the M2 Ultra, a new system on a chip (SoC) that delivers substantial performance increases to the Mac and completes the M2 family. It is the largest and most capable chip Apple has ever created.
The new M2 Ultra, built using 5nm technology, consists of 134 billion transistors, and its unified memory architecture supports up to a breakthrough 192GB of memory capacity and features 800GB/s of memory bandwidth. It will feature 24 CPU cores, up to 76 GPU cores (a 60-core option), and a 32-core Neural Engine. The CPU consists of 16 next-gen high-performance cores and eight high-efficiency cores.
M2 Ultra is built from two M2 Max dies connected through UltraFusion, Apple’s industry-leading, custom-built packaging technology that uses a silicon interposer that connects the dies with more than 10,000 signals, providing over 2.5TB/s of low-latency interprocessor bandwidth.
“M2 Ultra delivers astonishing performance and capabilities for our pro users’ most demanding workflows while maintaining Apple silicon’s industry-leading power efficiency,” said Johny Srouji, Apple’s senior vice president of Hardware Technologies. “With huge performance gains in the CPU, GPU, and Neural Engine, combined with massive memory bandwidth in a single SoC, M2 Ultra is the world’s most powerful chip ever created for a personal computer.”
Today, Apple is carbon neutral for global corporate operations, and they plan to have a net-zero climate impact across the entire business, which includes manufacturing supply chains and all product life cycles, by 2030. This also means that every chip Apple creates, from design to manufacturing, will be 100 percent carbon neutral.